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PA66 Solid State Polymerization/Drying Technology and Engineering
- Categories:Engineering Technology
- Time of issue:2022-01-26 13:58:40
- Views:0
Hiscien Engineering’s PA66 chips drying technology for textile spinning is similar to the drying of PA6 chips. Circulating nitrogen is used as the drying media. The moisture in the N2 is removed by scrubber or chilled water condenser or continuous molecular sieve dehumidifier. According to the requirement of spinning process, the chips moisture content can be controllable between 250 to 700ppm.
The PA66 SSP technology for IDY spinning is just the process extension based on the above drying process. The RV specification of the chips after SSP can be flexible according to different requirements
·Typical Raw Material & Product
➢Raw Material
Relative viscosity(ηr)(central value ) | 2.5~2.6(96% H2SO4) |
Moisture |
0.1~0.5% |
➢Dried Chips
Moisture |
250~900ppm±50ppm |
➢High Viscosity Chips
Relative viscosity(ηr)(central value ) | 2.8~3.3(96% H2SO4) |
Moisture |
250~900ppm±50ppm |
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